Patent Assignment
Reel/Frame 026187/0532
Assignment of Assignor's Interest
Recorded: 2011-04-27
Pages: 2
Assignors
SHIEH, YUH CHERN
Executed: 2011-04-12
PU, HAN-PING
Executed: 2011-04-12
CHEN, YU-FENG
Executed: 2011-04-12
KUO, TIN-HAO
Executed: 2011-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Reduced-Stress Bump-on-Trace (Bot) Structures