IP Library Assignment 026196/0540
Patent Assignment
Reel/Frame 026196/0540

Merger

Recorded: 2011-04-28 Pages: 3
Assignor
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Packaging Substrate Having Electrical Connection Structure and Method for Fabricating the Same
Patent: 7,956,472 →
Application: 12/188,663 →
Publication: US 2009/0041981
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2008
From: HSU, SHIH-PING
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 021362/0740 →