Patent Assignment
Reel/Frame 026239/0057
Assignment of Assignor's Interest
Recorded: 2011-05-06
Pages: 2
Assignor
KOBAYASHI, HIRONORI
Executed: 2011-04-22
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, JAPAN
Covered Property
(1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.