IP Library › Assignment 064461/0905
Patent Assignment
Reel/Frame 064461/0905

Assignment of Assignor's Interest

Recorded: 2023-08-02 Pages: 3
Assignor
NITTO DENKO CORPORATION
Executed: 2023-07-18
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties (2)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 8,421,249 →
Application: 13/102,674 →
Publication: US 2011/0272828
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 9,340,700 →
Application: 13/611,559 →
Publication: US 2013/0062790
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2011
From: KOBAYASHI, HIRONORI
To: NITTO DENKO CORPORATION
Reel/Frame 026239/0057 →
Assignment of Assignor's Interest Sep 12, 2012
From: IWASHIGE, TOMOHITO; ICHIKAWA, TOMOAKI; SUGIMOTO, NAOYA
To: NITTO DENKO CORPORATION
Reel/Frame 028944/0646 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →