IP Library › Assignment 028944/0646
Patent Assignment
Reel/Frame 028944/0646

Assignment of Assignor's Interest

Recorded: 2012-09-12 Pages: 2
Assignors
IWASHIGE, TOMOHITO
Executed: 2012-08-23
ICHIKAWA, TOMOAKI
Executed: 2012-08-23
SUGIMOTO, NAOYA
Executed: 2012-08-23
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, JAPAN
Covered Property (1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 9,340,700 →
Application: 13/611,559 →
Publication: US 2013/0062790
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2023
From: NITTO DENKO CORPORATION
To: RESONAC CORPORATION
Reel/Frame 064461/0905 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →