Patent Assignment
Reel/Frame 026242/0902
Assignment of Assignor's Interest
Recorded: 2011-05-09
Pages: 5
Assignee
ADVANPACK SOLUTIONS PTE. LTD.
BLK 21 KALLANG AVENUE, #02-167, KALLANG, 339412, SINGAPORE
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof