Patent Assignment
Reel/Frame 026242/0982
Assignment of Assignor's Interest
Recorded: 2011-05-09
Pages: 3
Assignor
HAYASHI, MASASHI
Executed: 2011-05-09
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Wafer Defect Inspection Apparatus and Method for Inspecting a Wafer Defect