Patent Assignment
Reel/Frame 026276/0952
Assignment of Assignor's Interest
Recorded: 2011-05-13
Pages: 4
Assignors
ICHIKAWA, HIROFUMI
Executed: 2011-04-21
HAYASHI, MASAKI
Executed: 2011-04-22
SASAOKA, SHIMPEI
Executed: 2011-04-25
MIKI, TOMOHIDE
Executed: 2011-04-25
Assignee
NICHIA CORPORATION
491-100, OKA, KAMINAKA-CHO, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Property
(1)
Light Emitting Device, Resin Package, Resin-Molded Body, and Methods for Manufacturing Light Emitting Device, Resin Package and Resin-Molded Body