Patent Assignment
Reel/Frame 026279/0312
Assignment of Assignor's Interest
Recorded: 2011-05-13
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2011-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Chip Having Different Pad Width to Ubm Width Ratios and Method of Manufacturing the Same