Assignment of Assignor's Interest

Recorded: 2011-05-23 Received: 2011-05-23 Pages: 4

Assignor

IP CUBE PARTNERS CO. LTD.

Executed: 2011-05-12

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KRX, KOREA, REPUBLIC OF

Covered Properties (10)

Photoresist Composition and Method of Forming Pattern by Using the Same

Application: 13/037,212 →

Optoelectronic Component with Flip-Chip Mounted Optoelectronic Device

Application: 12/837,734 →

Optical Assemblies

Application: 12/534,446 →

Electronic Device Package and Method of Formation

Application: 12/338,918 →

Electronic Device Packages and Methods of Formation

Application: 12/072,157 →

External cavity semiconductor laser and method for fabrication thereof

Application: 11/983,843 →

Multi-level optical structure and method of manufacture

Application: 11/891,721 →

Vehicular Vision System

Application: 11/837,114 →

Optical Device Package

Application: 11/503,023 →

Micro-Optical Device and Method of Making Same

Application: 11/335,722 →