IP Library › Assignment 026324/0332
Patent Assignment
Reel/Frame 026324/0332

Assignment of Assignor's Interest

Recorded: 2011-05-23 Pages: 3
Assignors
TAKASAWA, YUSHIN
Executed: 2011-03-29
HIROSE, YOSHIRO
Executed: 2011-03-29
KAMAKURA, TSUKASA
Executed: 2011-03-29
KAGA, YUKINAO
Executed: 2011-03-29
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, and Substrate Processing Apparatus
Patent: 8,410,001 →
Application: 13/047,367 →
Publication: US 2011/0230057
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →