Assignment of Assignor's Interest

Recorded: 2011-05-24 Pages: 3

Assignor

SUGIYAMA, TAKESHI

Executed: 2011-05-23

Assignee

SEIKO INSTRUMENTS INC.

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN

Covered Property (1)

Wafer and Package Product Manufacturing Method

Patent: 8,461,665 →

Application: 13/114,415 →

Publication: US 2011/0220383

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.