Patent Assignment
Reel/Frame 038054/0501
Assignment of Assignor's Interest
Recorded: 2016-03-21
Pages: 6
Assignor
SII CRYSTAL TECHNOLOGY INC.
Executed: 2016-02-26
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Properties
(4)
Electronic Component and Electronic Device
Wafer and Package Product Manufacturing Method
Glass Substrate Polishing Method, Package Manufacturing Method, Piezoelectric Vibrator, Oscillator, Electronic Device and Radio Timepiece
Method of Manufacturing Packages
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2010
From: TAKEUCHI, HITOSHI; SATO, KEIJI; ARATAKE, KIYOSHI; NUMATA, MASASHI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 024229/0436 →
Assignment of Assignor's Interest
May 24, 2011
From: SUGIYAMA, TAKESHI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 026332/0732 →
Assignment of Assignor's Interest
Jun 17, 2011
From: FUJIHIRA, YOUICHI; SUGAMA, KAZUYOSHI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 026454/0400 →
Assignment of Assignor's Interest
Jul 14, 2011
From: FUKUDA, JUNYA
To: SEIKO INSTRUMENTS INC.
Reel/Frame 026592/0954 →
Assignment of Assignor's Interest
Aug 26, 2013
From: SEIKO INSTRUMENTS INC.
To: SII CRYSTAL TECHNOLOGY INC.
Reel/Frame 031085/0852 →