IP Library › Assignment 026394/0611
Patent Assignment
Reel/Frame 026394/0611

Assignment of Assignor's Interest

Recorded: 2011-06-06 Pages: 2
Assignors
QUINONES, MARIA CLEMONS Y.
Executed: 2008-12-12
ESTACIO, MARIA CRISTINA B.
Executed: 2008-12-12
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL ROAD, SOUTH PORTLAND, MAINE, 04106
Covered Property (1)
Semiconductor Die Package Including Low Stress Configuration
Patent: 8,106,501 →
Application: 12/334,127 →
Publication: US 2010/0148346
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
Assignment of Assignor's Interest Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 040075, Frame 0644 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →