Patent Assignment
Reel/Frame 026398/0151
Assignment of Assignor's Interest
Recorded: 2011-06-06
Pages: 10
Assignors
FEGER, CLAUDIUS
Executed: 2011-06-06
MCLEOD, MARK H.
Executed: 2011-06-02
NAH, JAE-WOONG
Executed: 2011-06-06
PERFECTO, ERIC D.
Executed: 2011-06-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Injection Molded Solder Process for Forming Solder Bumps on Substrates