Patent Assignment
Reel/Frame 026416/0502
Assignment of Assignor's Interest
Recorded: 2011-06-09
Pages: 3
Assignee
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property
(1)
Packaged Device Including Interposer for Increased Adhesive Thickness and Method of Attaching Die to Substrate
Application:
13/156,509 →
Publication:
US 2012/0313190
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.