Patent Assignment
Reel/Frame 030369/0471
Merger
Recorded: 2013-05-07
Pages: 5
Assignor
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Executed: 2012-10-30
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Properties
(86)
High Value Resistors in Gallium Arsenide
Semiconductor package and fabrication method
Application:
10/985,312 →
Publication:
US 2006/0099733
Power supply and electronic device having integrated power supply
Application:
11/371,761 →
Publication:
US 2007/0210748
Microcap packaging of micromachined acoustic devices
Application:
11/640,051 →
Publication:
US 2008/0144863
Piezoelectric acceleration sensor
Application:
11/712,575 →
Publication:
US 2008/0202239
Piezoelectric Resonator Structures and Electrical Filters Having Frame Elements
PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE
Application:
11/750,606 →
Publication:
US 2008/0283944
Single-ended to differential duplexer filter
Application:
11/801,446 →
Publication:
US 2008/0101263
Hybrid Acoustic Resonator-Based Filters
Application:
11/860,107 →
Publication:
US 2009/0079514
Method for fabricating an acoustic mirror structure for a bulk acoustic wave structure
Application:
12/148,836 →
Publication:
US 2008/0241365
Method for forming an acoustic mirror with reduced metal layer roughness and related structure
A process of making a bulk acoustic wave structure with an aluminum copper nitride piezoelectric layer
Method and Apparatus to Transmit, Receive and Process Signals with Narrow Bandwith Devices
Piezoelectric Transducers with Noise-Cancelling Electrodes
Application:
12/270,251 →
Publication:
US 2010/0117485
Method for Wafer Trimming for Increased Device Yield
Application:
12/283,574 →
Publication:
US 2010/0068831
Apparatus and method for processing a wafer
Application:
12/359,657 →
Publication:
US 2009/0224180
Active Temperature Control of Piezoelectric Membrane-Based Micro-Electromechanical Devices
Transducer Device Including Feedback Circuit
Multi-Frequency Acoustic Array
Method of Manufacturing an Electrical resonator
Integrated Acoustic Horn and Lead Frame
Application:
12/609,176 →
Publication:
US 2011/0103632
Method and System for Determining the Time-of-Flight of a Signal
Application:
12/620,649 →
Publication:
US 2011/0119007
Transducer Device Having Coupled Resonant Elements
Polarity Determining Seed Layer and Method of Fabricating Piezoelectric Materials with Specific C-Axis
Acoustic Resonator Structure Having an Electrode with a Cantilevered Portion
Method of Fabricating an Electrode for a Bulk Acoustic Resonator
Application:
12/646,084 →
Publication:
US 2010/0107389
Low Capacitance Semiconductor Device
Method of Fabricating Piezoelectric Material with Selected C-Axis Orientation
Resonator Filter with Multiple Cross-Couplings
Impedance Matching Circuit Capable of Efficiently Isolating Paths for Multi-Band Power Amplifier
Packaged Acoustic Transducer Device with Shielding from Electromagnetic Interference
Application:
12/762,654 →
Publication:
US 2011/0254111
Resonator Device Including Electrode with Buried Temperature Compensating Layer
Method and System for Determining the Time-of-Flight of a Signal
Method and System for Determining the Time-of-Flight of an Acoustic Signal
Mems Transducer Device Having Stress Mitigation Structure and Method of Fabricating the Same
Application:
12/844,857 →
Publication:
US 2012/0025337
Packaged Device Including a Well for Containing a Die
Application:
12/859,524 →
Publication:
US 2012/0043628
Substrate Vias for Heat Removal from Semiconductor Die
Semiconductor Package Including Cap
Method of Forming Acoustic Resonator Using Intervening Seed Layer
High-Efficiency Power Amplifier with Multiple Power Modes
Combined Balun and Impedance Matching Circuit
Temperature Control of Micromachined Transducers
Single-Chip Duplexer with Isolation Shield Between Transmit and Receive Filters
Semiconductor Device Having an Airbridge and Method of Fabricating the Same
Semiconductor Component and Method for Producing Semiconductor Components
Application:
13/025,552 →
Publication:
US 2011/0133297
Microelectromechanical Systems (Mems) Package
Application:
13/029,314 →
Publication:
US 2012/0025335
Coupled Resonator Filter Comprising a Bridge
Multi-Band Wireless Communication Device with Multiplexer and Method of Multiplexing Multi-Band Wireless Signals
Stacked Acoustic Resonator Comprising a Bridge
Impedance Matching Arrangement for Amplifier Having Split Shunt Capacitor and Amplifier Including the Same
Double Film Bulk Acoustic Resonators with Electrode Layer and Piezo-Electric Layer Thicknesses Providing Improved Quality Factor
Stacked Bulk Acoustic Resonator Comprising Distributed Bragg Reflector
Application:
13/112,407 →
Publication:
US 2012/0293278
Film Bulk Acoustic Resonator Comprising a Bridge
Packaged Device Including Interposer for Increased Adhesive Thickness and Method of Attaching Die to Substrate
Application:
13/156,509 →
Publication:
US 2012/0313190
Capacitance Detector for Accelerometer and Gyroscope and Accelerometer and Gyroscope with Capacitance Detector
Coupled Resonator Filter Comprising a Bridge and Frame Elements
Stacked Bulk Acoustic Resonator Comprising a Bridge and an Acoustic Reflector Along a Perimeter of the Resonator
Bulk Acoustic Wave Resonator Comprising Bridge Formed Within Piezoelectric Layer
Duplexer with Shielding Bondwires Between Filters
Application:
13/209,499 →
Publication:
US 2013/0043961
Acoustic Resonator Formed on a Pedestal
Double Film Bulk Acoustic Resonator Having Electrode Edge Alignments Providing Improved Quality Factor or Electromechanical Coupling Coefficient
Accoustic Resonator Having Multiple Lateral Features
Device for Separating Signal Transmission and Reception and Communication System Including Same
Planarized Electrode for Improved Performance in Bulk Acoustic Resonators
Bulk Acoustic Resonator Comprising Piezoelectric Layer and Inverse Piezoelectric Layer
Dielectric Dummification for Enhanced Planarization with Spin-on Dielectrics
Application:
13/296,672 →
Publication:
US 2013/0119435
Semiconductor Structure Comprising Moisture Barrier and Conductive Redistribution Layer
Tuning of Mems Oscillator
Solid Mount Bulk Acoustic Wave Resonator Structure Comprising a Bridge
Apparatus Having Double Phase-Matched Configuration for Reducing Magnitude of Intermodulation Products
Temperature Controlled Acoustic Resonator
Film Bulk Acoustic Resonator with Multi-Layers of Different Piezoelectric Materials and Method of Making
Method of Fabricating Piezoelectric Materials with Opposite C-Axis Orientations
Power Amplifier Including Variable Capacitor Circuit
Acoustic Resonator Structure Comprising a Bridge
Application:
13/443,113 →
Publication:
US 2012/0194297
Acoustic Resonator Structure Comprising a Bridge
Application:
13/445,268 →
Publication:
US 2012/0206015
Apparatus and Method for Measuring Thickness of Printed Circuit Board
Application:
13/447,490 →
Publication:
US 2013/0275083
Pseudomorphic High Electron Mobility Transistor (Phemt) Comprising Low Temperature Buffer Layer
Radio Frequency Switch Comprising Heterojunction Biopolar Transistors
Application:
13/464,145 →
Publication:
US 2013/0293283
Multi-Aperture Acoustic Horn
Application:
13/470,733 →
Publication:
US 2012/0223620
Laterally-Coupled Acoustic Resonators
Acoustic Resonator Structure Having an Electrode with a Cantilevered Portion
Application:
13/529,192 →
Publication:
US 2012/0326807
Micromachined Horn
Power Amplifier
Resonator Device Including Electrode with Buried Temperature Compensating Layer
Application:
13/624,046 →
Publication:
US 2013/0015747
Hybrid Bulk Acoustic Wave Resonator
Application:
13/785,104 →
Publication:
US 2013/0176085
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2005
From: GEEFAY, FRANK S; RUBY, RICHARD C
To: AGILENT TECHNOLOGIES INC
Reel/Frame 015831/0453 →
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Security Agreement
Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
Assignment of Assignor's Interest
May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0434 →
Assignment of Assignor's Interest
May 25, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
Reel/Frame 017675/0001 →
Assignment of Assignor's Interest
Sep 19, 2006
From: UNKRICH, MARK; FRANK, MICHAEL; RUBY, RICHARD C.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGPAORE) PTE. LTD.
Reel/Frame 018271/0131 →
Assignment of Assignor's Interest
Apr 23, 2007
From: FAZZIO, R. SHANE; LAMERS, KRISTINA L.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 019195/0027 →
Assignment of Assignor's Interest
May 10, 2007
From: BARBER, BRADLEY PAUL; ZHANG, HAO
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 019364/0294 →
Assignment of Assignor's Interest
Jun 27, 2007
From: JAMNEALA, TIBERIU; RUBY, RICHARD C.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 019487/0768 →
Assignment of Assignor's Interest
Jun 27, 2007
From: FAZZIO, R. SHANE; LAMERS, KRISTINA L.; GOEL, ATUL
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 019487/0743 →
Assignment of Assignor's Interest
Feb 7, 2008
From: JAMNEALA, TIBERIU; SMALL, MARTHA; RUBY, RICHARD C.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 020513/0443 →
Assignment of Assignor's Interest
Feb 14, 2008
From: GEEFAY, FRANK S.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE PTE. LTD.
Reel/Frame 020568/0419 →
Assignment of Assignor's Interest
May 7, 2008
From: BARBER, BRADLEY; GEHLERT, PAUL P.; KENCHAPPA, SAHANA; SHEPARD, CHRISTOPHER F.
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 020915/0044 →
Assignment of Assignor's Interest
Aug 29, 2008
From: BARBER, BRADLEY P.; GEHLERT, PAUL P.; SHEPARD, CHRISTOPHER F.
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 021464/0752 →
Assignment of Assignor's Interest
Aug 29, 2008
From: BARBER, BRADLEY P.; GEHLERT, PAUL P.; SHEPARD, CHRISTOPHER F.
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 021464/0551 →
Assignment of Assignor's Interest
Nov 5, 2008
From: BUCCAFUSCA, OSVALDO; MARTIN, STEVEN; GOEL, ATUL
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 021827/0986 →
Assignment of Assignor's Interest
Nov 17, 2008
From: MARTIN, STEVEN; BUCCAFUSCA, OSVALDO
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 021887/0466 →
Assignment of Assignor's Interest
Feb 5, 2009
From: BUCCAFUSCA, OSVALDO
To: AVAGO TECHNOLOGIES WIRELESS IP(SINGAPORE)PTE.LTD
Reel/Frame 022211/0340 →
Assignment of Assignor's Interest
Mar 12, 2009
From: MARTIN, STEVEN; BUSCCAFUSCA, OSVALDO
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE)PTE.LTD.
Reel/Frame 022391/0961 →
Assignment of Assignor's Interest
May 4, 2009
From: AIGNER, ROBERT
To: AVAGO TECHNOLOGIES WIRELESS IP(SINGAPORE)PTE.LTD.
Reel/Frame 022636/0679 →
Assignment of Assignor's Interest
Jul 1, 2009
From: GRANNEN, KEVIN J.; ROGERS, CARRIE A.; CHOY, JOHN
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE.LTD
Reel/Frame 022896/0298 →
Assignment of Assignor's Interest
Jul 1, 2009
From: BUCCAFUSCA, OSVALDO; GOEL, ATUL; MARTIN, STEVEN; PHILLIBER, JOEL
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD
Reel/Frame 022896/0419 →
Assignment of Assignor's Interest
Sep 21, 2009
From: SKYWORKS SOLUTIONS INC.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023254/0726 →
Assignment of Assignor's Interest
Nov 6, 2009
From: LECLAIR, TIMOTHY; GOEL, ATUL
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023482/0283 →
Assignment of Assignor's Interest
Dec 8, 2009
From: FAZZIO, R. SHANE
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023617/0697 →