PACKAGED ACOUSTIC TRANSDUCER DEVICE WITH SHIELDING FROM ELECTROMAGNETIC INTERFERENCE
A device includes: a housing structure; lid configured together with the housing structure to define a cavity therein; and at least one acoustic transducer disposed within the cavity, wherein the lid shields the at least one acoustic transducer from exposure to electromagnetic interference from electromagnetic radiation originating outside the device. In some embodiments, the housing structure includes some electrically conductive leads, including a ground lead, and the lid is directly connected to the ground lead.
1 . A device, comprising:
an electrically conductive lead frame having an aperture therethrough, the electrically conductive lead frame including a plurality of leads including at least one ground lead configured to be connected to an electrical ground;
a semiconductor die including at least one acoustic transducer disposed above the aperture in the electrically conductive lead frame, the at least one acoustic transducer being configured to convert between acoustic energy and an electrical signal;
an acoustic horn integrally connected to the lead frame, the horn extending from the lead frame and comprising a throat positioned adjacent to the acoustic transducer and a mouth opening at an opposite end of the acoustic horn from the throat;
an electrically conductive and acoustically transmissive screen disposed over the mouth of the acoustic horn; and
an electrically conductive lid configured together with the base portion of the housing to define a cavity, wherein the acoustic transducer is positioned within the cavity, and wherein the electrically conductive lid is directly connected to the ground lead.
2 . The device of claim 1 , wherein the semiconductor die includes a through-hole aligned with the aperture in the lead frame and wherein the acoustic transducer includes a diaphragm disposed above the through-hole in the semiconductor die.
3 . The device of claim 1 , further including at least one bond wire connected between a pad on the semiconductor die and at least one lead of the lead frame.
4 . The device of claim 1 , wherein the acoustic transducer comprises a micro electro-mechanical system (MEMS) transducer.
5 . The device of claim 1 , wherein the cavity is hermetically sealed.
6 . The device of claim 1 , wherein the acoustic horn comprises plastic transfer molded through a portion of the lead frame and extending from the lead frame to the mouth of the horn.
7 . The device of claim 1 , further comprising:
a substrate mounted on a base portion of the acoustic horn; and
an amplifier mounted on the substrate and electrically connected to the acoustic transducer.
8 . The device of claim 1 , wherein the electrically conductive lid is connected to the ground lead.
9 . A device, comprising:
a housing structure including having a base portion integrated with a plurality of electrically conductive leads including at least one ground lead, the housing structure including an aperture extending through a first side thereof;
an electrically conductive lid configured together with the housing structure to define a cavity therein; and
at least one acoustic transducer disposed within the cavity and disposed above the aperture in the housing structure,
wherein the electrically conductive lid is directly connected to the ground lead.
10 . The device of claim 9 , further comprising an amplifier disposed within the cavity and electrically connected to the acoustic transducer.
11 . The device of claim 9 , wherein the housing structure includes an acoustic horn having a first opening at an end where the base portion is connected to the electrically conductive leads, the first opening surrounding the aperture in the housing structure, and having a second opening at an opposite end of the acoustic horn from the first opening, wherein a diameter of the second opening is greater than a diameter of the first opening.
12 . The device of claim 11 , further comprising an electrically conductive and acoustically transmissive screen disposed over the mouth of the acoustic horn.
13 . The device of claim 9 , wherein the acoustic device includes a diaphragm disposed above a through-hole in a semiconductor substrate, wherein the through-hole is aligned with the aperture in the housing structure.
14 . The device of claim 13 , further including at least one bond wire connected between a pad on the semiconductor die and at least one lead of the lead frame.
15 . The device of claim 9 , wherein the acoustic transducer comprises a micro electro-mechanical system (MEMS) transducer.
16 . The device of claim 9 , wherein the cavity is hermetically sealed.
17 . A device, comprising:
a housing structure;
a lid configured together with the housing structure to define a cavity therein; and
at least one acoustic transducer disposed within the cavity,
wherein the lid shields the at least one acoustic transducer from exposure to electromagnetic interference from electromagnetic radiation originating outside the device.
18 . The device of claim 17 , wherein the housing structure includes a ground lead connected to the lid.
19 . The device of claim 17 , further comprising:
an acoustic horn communicating acoustic energy between the acoustic transducer and an exterior of the device; and
an electrically conductive and acoustically transmissive screen disposed over the mouth of the acoustic horn.
20 . The device of claim 17 , further comprising an amplifier disposed within the cavity and electrically connected to the acoustic transducer.