Method for forming an acoustic mirror with reduced metal layer roughness and related structure
View Patent ↗According to an exemplary embodiment, a method of forming a metal layer having reduced roughness includes a step of forming a seed layer over a dielectric layer. The method further includes a step of forming the metal layer over the seed layer. The seed layer causes a top surface of the metal layer to have reduced roughness. The seed layer and the metal layer can be formed in a same process chamber or in different process chambers. The dielectric layer, the seed layer, and the metal layer having reduced roughness can be utilized in an acoustic mirror structure.
1. An apparatus, comprising:
an acoustic mirror comprising: a first dielectric layer disposed over a substrate; a first seed layer disposed over said first dielectric layer; a first metal layer having a top surface, said first metal layer being disposed over said first seed layer; wherein said first seed layer causes said top surface of said first metal layer to have a reduced roughness;
a lower electrode disposed over the acoustic mirror; a piezoelectric layer disposed over the lower electrode; and an upper electrode disposed over the piezoelectric layer.
2. The apparatus of claim 1 , wherein an interface between said first seed layer and said first metal layer forms a gradual transition between said first seed layer and said first metal layer.
3. The apparatus of claim 1 , wherein said first seed layer comprises a compound comprising a same metal in said metal layer.
4. The apparatus of claim 1 , wherein said first seed layer comprises a compound not comprising a same metal in said metal layer.
5. The apparatus of claim 1 further comprising: a second dielectric layer situated over first metal layer; a second seed layer situated over said second dielectric layer; a second metal layer situated over said second seed layer.