IP Library Granted Patent US 9,048,812
Granted Patent B2
US 9,048,812 · App. 13/208,909 · Granted Jun 2, 2015

Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer

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Quick Facts
Patent No.
US 9,048,812
App. No.
13/208,909
Granted
Jun 2, 2015
Kind
B2
Abstract

A bulk acoustic wave (BAW) structure includes a first electrode disposed over a substrate, a piezoelectric layer disposed over the first electrode, and a second electrode disposed over the first piezoelectric layer. A bridge is formed within the piezoelectric layer, where the bridge is surrounded by piezoelectric material of the piezoelectric layer.

Claims (36)

1. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a bridge buried within the piezoelectric layer, wherein the bridge defines at least a portion of a perimeter along an active region of the BAW resonator structure.

2. The BAW resonator structure of claim 1 , wherein the bridge comprises an unfilled bridge, containing air.

3. The BAW resonator structure of claim 1 , wherein the bridge comprises a filled bridge, containing a dielectric material.

4. The BAW resonator structure of claim 3 , wherein the dielectric material comprises one of non-etchable borosilicate glass (NEBSG), carbon doped silicon dioxide (CDO), or silicon carbide (SiC).

5. The BAW resonator structure of claim 1 , wherein the bridge comprises a filled bridge, containing a metal.

6. The BAW resonator structure of claim 5 , wherein the metal comprises one of tungsten (W), molybdenum (Mo), copper (Cu) or iridium (Ir).

7. The BAW resonator structure of claim 1 , wherein the bridge has a trapezoidal cross-sectional shape.

8. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a first piezoelectric layer disposed over the first electrode;

a second electrode disposed over the first piezoelectric layer;

a second piezoelectric layer disposed over the second electrode;

a third electrode disposed over the second piezoelectric layer; and

a first bridge buried within one of the first piezoelectric layer and the second piezoelectric layer.

9. The BAW resonator structure of claim 8 , wherein the first bridge comprises an unfilled bridge, containing air.

10. The BAW resonator structure of claim 8 , further comprising:

a second bridge buried within the other one of the first piezoelectric layer and the second piezoelectric layer.

11. The BAW resonator structure of claim 10 , wherein at least one of the first bridge and the second bridge comprises an unfilled bridge, containing air.

12. The BAW resonator structure of claim 10 , wherein at least one of the first bridge and the second bridge comprises a filled bridge, containing a fill material having an acoustic impedance.

13. The BAW resonator structure of claim 12 , wherein the fill material comprises one of dielectric material or a metal.

14. A bulk acoustic wave (BAW) resonator structure, comprising:

a first BAW resonator comprising a first electrode, a first piezoelectric layer disposed over the first electrode, and a second electrode disposed over the first piezoelectric layer;

an acoustic coupling layer disposed over the second electrode of the first BAW resonator, wherein the acoustic coupling layer is configured to determine pass-band characteristics of the BAW resonator structure;

a second BAW resonator comprising a third electrode disposed over the acoustic coupling layer, a second piezoelectric layer disposed over the third electrode, and a fourth electrode disposed over the second piezoelectric layer; and

a first bridge buried within one of the first piezoelectric layer of the first BAW resonator and the second piezoelectric layer of the second BAW resonator.

15. The BAW resonator structure of claim 14 , wherein the first bridge comprises an unfilled bridge, containing air.

16. The BAW resonator structure of claim 14 , further comprising:

a second bridge buried within the other one of the first piezoelectric layer of the first BAW resonator and the second piezoelectric layer of the second BAW resonator.

17. The BAW resonator structure of claim 16 , wherein at least one of the first bridge and the second bridge comprises an unfilled bridge, containing air.

18. The BAW resonator structure of claim 17 , wherein at least one of the first bridge and the second bridge comprises a filled bridge, containing a fill material having an acoustic impedance.

19. The BAW resonator structure of claim 18 , wherein the fill material comprises one of dielectric material or a metal.

20. The BAW resonator structure of claim 17 , wherein the acoustic coupling layer comprises at least one of carbon doped oxide (CDO) and NEBSG.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2011
From: BURAK, DARIUSZ; NIKKEL, PHIL; KAITILA, JYRKI; LARSON, JOHN D., III; SHIRAKAWA, ALEXANDRE
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 026745/0909 →