PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE

1 . A method of fabricating a microelectromechanical (MEM) device, the method comprising:

selectively exposing at least a portion of a photostructurable glass substrate to radiation;

heating the substrate to at least partially crystallize the exposed portion of the substrate;

selectively etching at least a portion of the substrate in a solution to provide features in the substrate, wherein the etching of the at least partially crystallized portions of the substrate proceeds at a significantly greater rate than the unexposed portions of the substrate.

2 . A method as claimed in claim 1 , wherein the features comprise a cavity in a side of the substrate, and the method further comprises:

providing a film bulk acoustic resonator (FBAR) device over the cavity.

3 . A method as claimed in claim 1 , wherein the features include a via extending into the substrate and the method further comprises:

providing a conductor in the via.

4 . A method as claimed in claim 1 , wherein the method further comprises:

forming a microcap in another substrate, wherein the microcap structure has a gasket;

providing an adhesive material over the gasket; and

adhering the gasket to the substrate.

5 . A method as claimed in claim 4 , wherein the features include a via extending into the other substrate and the method further comprises:

providing a conductor in the via.

6 . A method as claimed in claim 1 , wherein the exposing further comprises:

directing light from a first light source to a region of the substrate;

directing light from a second light source to the region of the substrate, wherein the light from the first and second light sources overlap at least partially in the region.

7 . A method as claimed in claim 1 , wherein the exposing substantially separates silver atoms from a glass compound comprising the substrate, and the heating substantially crystallizes the glass around the silver atoms.

8 . A film bulk acoustic structure (FBA), comprising:

a photostructurable glass substrate;

a cavity provided in a surface of the substrate; and

an FBA disposed at least partially over the cavity.

9 . An FBA structure as claimed in claim 8 , further comprising at least one conductive via disposed in the substrate and adapted to connect a contact pad on another surface of the substrate to a contact pad on the surface.

10 . An FBA structure as claimed in claim 8 , further comprising a microcap structure disposed over the substrate and including a gasket, which contact the surface.

11 . An FBA structure as claimed in claim 10 , further comprising at least one conductive via disposed in the microcap and adapted to connect a contact pad on the microcap to a contact pad on the surface.

12 . An FBA structure as claimed in claim 8 , wherein the cavity extends through the substrate from the surface through another surface.

13 . An FBA structure as claimed in claim 12 , wherein the FBA is a microphone.

14 . An FBA structure as claimed in claim 8 , wherein the FBA is a resonator (FBAR).

15 . A microcap structure, comprising:

a photostructurable glass substrate;

a cavity provided in a surface of the substrate; and

a glass gasket extending from the substrate.

16 . A microcap structure as claimed in claim 15 , further comprising an adhesive layer disposed at least partially over the gasket, and adapted to bond the microcap structure to another structure.

17 . A microcap structure as claimed in claim 16 , wherein the other substrate is a semiconductor substrate.

18 . A microcap structure as claimed in claim 15 , further comprising at least one conductive via disposed in the microcap and adapted to connect a contact pad on the microcap to another contact pad.

19 . A microcap structure as claimed in claim 15 , wherein the glass gasket is a photostructurable glass.

20 . A microcap structure as claimed in claim 16 , wherein the other substrate further comprises at least one conductive via.