Single-chip duplexer with isolation shield between transmit and receive filters
View Patent ↗A single-chip duplexer, interfacing a receiver and a transmitter with a common antenna, includes transmit and receive filters, an annular sealing ring and a conductive stripe. The transmit filter is connected between the antenna and the transmitter, and has a transmit passband. The receive filter is connected between the antenna and the receiver, and has a receive passband different from the transmit passband. The annular sealing ring is connected between a surface of the chip and a surface of a cap to form a sealed cavity between the chip and the cap. The conductive stripe extends across at least a portion of the surface of the chip between the transmit filter and the receive filter, the conductive stripe being directly connected to the sealing ring and electrically connected to ground. The conductive stripe provides at least one of magnetic shielding and capacitive shielding between the transmit filter and the receive filter.
1. A duplexer interfacing a receiver and a transmitter with a common antenna, the duplexer comprising:
a transmit filter on a chip connected between the antenna and the transmitter, the transmit filter having a transmit passband;
a receive filter on the chip connected between the antenna and the receiver, the receive filter having a receive passband different from the transmit passband;
an annular sealing ring connected between a first surface of the chip and a first surface of a cap to form a sealed cavity between the chip and the cap;
a support pillar extending between the first surface of the chip and the first surface of the cap to separate the chip and the cap, a support conductor being formed along the support pillar; and
a conductive stripe extending across a portion of the first surface of the chip and a portion of the first surface of the cap between the transmit filter and the receive filter, the conductive stripe being electrically connected to ground, and providing at least one of magnetic shielding and capacitive shielding between the transmit filter and the receive filter, wherein the conductive stripe comprises:
a first conductive stripe portion extending across the portion of the first surface of the chip from the annular sealing ring to the support pillar, the first conductive stripe portion being directly connected at one end to the annular sealing ring and at an opposite end to the support conductor; and
a second conductive stripe portion extending across the portion of the first surface of the cap from the support pillar, the second conductive strip portion being connected at one end to the opposite end of the first conductive stripe portion via the support conductor.
2. The duplexer of claim 1 , wherein the transmit filter comprises a plurality of first film bulk acoustic resonators (FBARs), and the receive filter comprises a plurality of second FBARs.
3. The duplexer of claim 1 , wherein the transmit filter comprises a plurality of first bulk acoustic wave (BAW) resonators, and the receive filter comprises a plurality of second BAW resonators.
4. The duplexer of claim 1 , further comprising:
a first conductive interconnector extending through a corresponding via in the cap and connecting the conductive stripe on the first surface of the chip with a first ground pad on a second surface of the cap, opposite the first surface of the cap.
5. The duplexer of claim 4 , further comprising:
a second conductive interconnector extending through a corresponding via in the cap and connecting the conductive stripe on the first surface of the cap with a second ground pad on the second surface of the cap.
6. The duplexer of claim 1 , wherein the second conductive stripe portion is directly connected at an opposite end to the annular sealing ring.
7. The duplexer of claim 1 , wherein the second conductive stripe portion is not directly connected at an opposite end to the annular sealing ring.
8. The duplexer of claim 1 , wherein the sealing ring is formed substantially along an outer periphery of the chip.
9. The duplexer of claim 8 , wherein each of the chip and the cap comprises gallium arsenide (GaAs).
10. The duplexer of claim 8 , wherein each of the chip and the cap comprises indium phosphide (InP).
11. The duplexer of claim 8 , wherein each of the chip and the cap comprises silicon (Si).
12. The duplexer of claim 8 , wherein the annular sealing ring comprises gold, and the conductive stripe comprises at least one of molybdenum and tungsten.
13. A duplexer on a single semiconductor chip interfacing a receiver and a transmitter with a common antenna, the duplexer comprising:
a transmit filter on the semiconductor chip connected between an antenna terminal and a transmitter terminal, the transmit filter comprising a plurality of transmit film bulk acoustic resonators (FBARs);
a receive filter on the semiconductor chip connected between the antenna terminal and a receiver terminal, the receive filter comprising a plurality of receive FBARs;
an annular sealing ring around a periphery of the semiconductor chip for creating a sealed cavity between the semiconductor chip and a corresponding semiconductor cap attached to a surface of the semiconductor chip via the annular sealing ring; and
an isolation shield directly connected to the annular sealing ring and positioned between the transmit filter and the receive filter, the isolation shield reducing at least one of magnetic coupling and capacitive coupling between the transmit filter and the receive filter.
14. The duplexer of claim 13 , wherein the isolation shield comprises a conductive stripe extending across the surface of the semiconductor chip between the transmit filter and the receive filter, the conductive stripe being directly connected at a first end and a second end to the annular sealing ring.
15. The duplexer of claim 13 , wherein the isolation shield comprises a conductive stripe extending across a portion of the surface of the semiconductor chip between the transmit filter and the receive filter, the conductive stripe being directly connected only at a first end to the annular sealing ring.
16. The duplexer of claim 13 , wherein the isolation shield comprises:
a first conductive stripe portion extending across a portion of the surface of the semiconductor chip, the first conductive stripe portion being directly connected only at a first end to the annular sealing ring; and
a second conductive stripe portion extending across a portion of a surface of the semiconductor cap facing the surface of the semiconductor chip, the second conductive stripe portion being directly connected to the annular sealing ring at a first end and connected via a support conductor to the first conductive strip portion at a second end.
17. The duplexer of claim 13 , wherein the transmit filter comprises first series FBARs connected in series between the antenna terminal and the transmitter terminal, and first shunt FBARs respectively connected between at least one of the first series FBARS and ground; and
wherein the receive filter comprises second series FBARs connected in series between the antenna terminal and the receiver terminal, and second shunt FBARs respectively connected between at least one of the second series FBARS and ground.
18. A duplexer device comprising:
a semiconductor chip;
a semiconductor cap connected to the semiconductor chip via a conductive annular sealing ring, the annular sealing ring forming a sealed cavity between the semiconductor chip and the semiconductor cap;
a transmit filter on the semiconductor chip connected between an antenna terminal corresponding to a common antenna and a transmitter terminal corresponding to a transmitter, the transmit filter comprising a first plurality of acoustic resonators;
a receive filter on the semiconductor chip connected between the antenna terminal and a receiver terminal corresponding to a receiver, the receive filter comprising a second plurality of acoustic resonators;
a conductive stripe positioned between the transmit filter and the receive filter, the conductive stripe being directly connected to the annular sealing ring and electrically connected to at least one ground pad by a conductive interconnector through a via in the semiconductor cap, the conductive stripe increasing isolation between the transmit filter and the receive filter,
wherein each of the first and second plurality of acoustic resonators comprises one of a film bulk acoustic resonator (FBAR) or a bulk acoustic wave (BAW) resonator.
19. The duplexer device of claim 18 , wherein the conductive stripe comprises a first end directly connected to the annular sealing ring on one side of the duplexer device and a second end directly connected to the annular sealing ring on an opposite side of the duplexer device.