Acoustic resonator formed on a pedestal
View Patent ↗An acoustic resonator structure comprises a substrate having a trench, a conductive pattern formed in the trench, a pillar formed within the trench, and an acoustic resonator supported at a central location by the pillar and suspended over the trench.
1. An acoustic resonator structure, comprising:
a substrate comprising a trench;
a conductive pattern disposed in the trench;
a pillar disposed within the trench; and
an acoustic resonator supported by the pillar and suspended over the trench, the acoustic resonator comprising: a lower electrode electrically connected to a first part of the conductive pattern; an upper electrode connected to a second part of the conductive pattern through a via located above the pillar; and a piezoelectric layer located between the lower electrode and the upper electrode.
2. The acoustic resonator structure of claim 1 , further comprising a spacer disposed between the piezoelectric layer and the upper electrode, wherein the spacer comprises non-etchable borosilicate glass (NEBSG) or an air gap.
3. The acoustic resonator structure of claim 1 , wherein the acoustic resonator comprises a film bulk acoustic resonator (FBAR).
4. The acoustic resonator structure of claim 1 , wherein the acoustic resonator has an annular shape arranged around the pillar.
5. The acoustic resonator structure of claim 4 , wherein the annular shape comprises an overlap of the upper electrode and the lower electrode that does not overlap the pillar.
6. The acoustic resonator structure of claim 1 , wherein the acoustic resonator is supported by the pillar at a center of the acoustic resonator, or the acoustic resonator is supported by the pillar at a location offset relative to the center of the acoustic resonator.
7. The acoustic resonator structure of claim 1 , wherein the acoustic resonator has an active region that is suspended entirely over the trench.
8. The acoustic resonator structure of claim 1 , further comprising a tether connecting an edge of the acoustic resonator to a portion of the substrate.
9. The acoustic resonator structure of claim 8 , wherein the tether is connected to an electrical trace on the substrate.
10. The acoustic resonator structure of claim 8 , wherein the tether becomes an electrical connection to a trace on the substrate.
11. The acoustic resonator structure of claim 1 , further comprising an integrated circuit coupled to the acoustic resonator.
12. The acoustic resonator structure of claim 1 , further comprising a silicon microcap disposed over the substrate and covering the acoustic resonator.
13. The acoustic resonator structure of claim 1 , wherein the lower electrode is in direct contact with the first part of the conductive pattern and is electrically isolated from the second part of the conductive pattern.
14. The acoustic resonator structure of claim 1 , wherein the conductive pattern comprises tungsten or molybdenum, and the lower and upper electrodes each comprise tungsten or molybdenum.
15. The acoustic resonator structure of claim 1 , wherein the substrate comprises silicon, and the pillar is formed integral to the substrate.
16. The acoustic resonator structure of claim 1 , wherein the pillar comprises a thermally resistant oxide.
17. A method of fabricating an acoustic resonator structure, comprising:
forming a trench in a substrate;
forming a pillar in a central portion of the trench;
forming a conductive pattern in the trench;
forming an acoustic resonator supported by the pillar, and an active region formed around the pillar and suspended over the trench, the forming the active region comprising: forming a sacrificial layer in the trench; forming a lower electrode on the sacrificial layer and connected to a first part of the conductive pattern; forming a piezoelectric layer on the lower electrode; forming an upper electrode on the piezoelectric layer; forming an electrical connection from the upper electrode to a second part of the conductive pattern by depositing a conductive material in a via formed above the pillar; and removing the sacrificial layer from the trench.
18. The method of claim 17 , wherein the pillar is formed integral to the substrate, and forming the pillar comprises etching the substrate in a region defining the trench such that the pillar remains in a central portion of the trench.
19. The method of claim 18 , wherein the acoustic resonator is a film bulk acoustic resonator (FBAR).
20. The method of claim 17 , further comprising:
forming a tether to connect an edge of the acoustic resonator to a portion of the substrate at an edge of the trench.
21. The method of claim 20 , further comprising forming a spacer between the piezoelectric layer and the upper electrode, wherein the spacer comprises a non-etchable borosilicate glass (NEBSG) or an air gap.
22. An acoustic resonator structure, comprising:
a substrate comprising a trench;
a pillar disposed within the trench, the pillar comprising a material that is substantially electrically non-conductive;
a conductive pattern disposed over the trench, the conductive pattern comprising: a first contact disposed over a first side of the trench and over a first side of the pillar; and a second contact disposed over a second side of the trench and over a second side of the pillar, wherein the first contact is electrically isolated from the second contact; and
an acoustic resonator supported by the pillar and suspended over the trench.
23. The acoustic resonator structure of claim 22 , wherein the acoustic resonator comprises a film bulk acoustic resonator (FBAR).
24. The acoustic resonator structure of claim 23 , wherein the acoustic resonator has an annular shape arranged around the pillar.
25. The acoustic resonator structure of claim 24 , wherein the annular shape comprises an overlap of the upper electrode and the lower electrode that does not overlap the pillar.
26. The acoustic resonator structure of claim 23 , wherein the acoustic resonator is either supported by the pillar at a center of the acoustic resonator or at a location that is offset relative to the center of the acoustic resonator.
27. The acoustic resonator structure of claim 23 , further comprising a tether connecting an edge of the acoustic resonator to a portion of the substrate.
28. The acoustic resonator structure of claim 27 , wherein the tether is connected to an electrical trace on the substrate.
29. The acoustic resonator structure of claim 23 , further comprising an integrated circuit coupled to the acoustic resonator.
30. The acoustic resonator structure of claim 23 , further comprising a silicon microcap disposed over the substrate and covering the acoustic resonator.
31. The acoustic resonator structure of claim 23 , wherein the substrate comprises silicon, and the pillar is formed integral to the substrate.
32. The acoustic resonator structure of claim 23 , wherein the pillar comprises a thermally resistant oxide.
33. The acoustic resonator of claim 22 , wherein the acoustic resonator comprises: a first electrode that is electrically connected to the first contact; and a second electrode that is electrically connected to the second contact.