IP Library Granted Patent US 9,093,979
Granted Patent B2
US 9,093,979 · App. 13/488,726 · Granted Jul 28, 2015

Laterally-coupled acoustic resonators

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Quick Facts
Patent No.
US 9,093,979
App. No.
13/488,726
Granted
Jul 28, 2015
Kind
B2
Abstract

An apparatus, comprises a piezoelectric layer, a first acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer, and a second acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer and acoustically coupled to the first acoustic resonator.

Claims (47)

1. An apparatus, comprising:

a piezoelectric layer;

a first acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer the first electrode of the first acoustic resonator comprising a first electrode bus connected to a first plurality of finger structures; and

a second acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer and acoustically coupled to the first acoustic resonator, the first electrode of the second acoustic resonator comprising a second electrode bus connected to a second plurality of finger structures, wherein the respective second electrodes do not overlap either the first electrode bus, or the second electrode bus.

2. The apparatus of claim 1 , wherein the first acoustic resonator is configured to receive a time-varying input signal and the second acoustic resonator is configured to transmit a time-varying, output signal that is related to the input signal according to a transfer function comprising a passband.

3. The apparatus of claim 2 , wherein the second plurality of finger structures are arranged in an interdigital configuration with respect to the first plurality of finger structures.

4. The apparatus of claim 3 , wherein the first and second pluralities of finger structures comprise fingers of different thicknesses.

5. The apparatus of claim 4 , wherein outermost fingers among the first and second pluralities of finger structures have a greatest thickness among fingers of the first and second pluralities of finger structures.

6. The apparatus of claim 4 , wherein next-outermost lingers among the first and second pluralities of finger structures have a smallest thickness among fingers of the first and second pluralities of finger structures.

7. The apparatus of claim 3 , wherein the first and second pluralities of fingers have a first thickness, and the first and second electrode buses have a second thickness greater than the first thickness.

8. The apparatus of claim 7 , wherein the second thickness is adapted to maintain a resonance associated with the first and second electrode buses away from the passband.

9. The apparatus of claim 3 , wherein the respective second electrodes of the first and second acoustic resonators are connected to ground, the first electrode of the first acoustic resonator is connected to an input terminal configured to receive the input signal, and the first electrode of the second acoustic resonator is connected to an output terminal configured to transmit the output signal.

10. The apparatus of claim 3 , wherein the first and second pluralities of finger structures comprise fingers of different widths or fingers separated by gaps of different sizes.

11. The apparatus of claim 3 , wherein the second electrode of the first acoustic resonator comprises a third electrode bus connected to a third plurality of finger structures, and the second electrode of the second acoustic resonator comprises a fourth electrode bus connected to a fourth plurality of finger structures arranged in an interdigital configuration with respect to the third plurality of finger structures.

12. The apparatus of claim 1 , wherein the respective first electrodes of the first and second acoustic resonators have an apodized shape.

13. The apparatus of claim 12 , wherein the respective second electrodes of the first and second acoustic resonators have an apodized shape.

14. The apparatus of claim 1 , wherein the first acoustic resonator is configured to receive an unbalanced input signal and the second acoustic resonator is configured to transmit a balanced output signal corresponding to the unbalanced input signal.

15. The apparatus of claim 14 , wherein the first electrode of the first acoustic resonator is connected to an input terminal configured to receive the unbalanced input signal, the second electrode of the first acoustic resonator is connected to ground, the first electrode of the second acoustic resonator is connected to a first output terminal configured to transmit a first output signal, and the second electrode of the second acoustic resonator is connected to a second output terminal configured to transmit a second output signal, wherein the first and second output signals form a balanced signal pair.

16. The apparatus of claim 1 , wherein the respective first electrodes of the first and second acoustic resonators are electrically separated from each other and the respective second electrodes of the first and second acoustic resonators are electrically connected to each other.

17. The apparatus of claim 1 , wherein the respective first electrodes of the first and second acoustic resonators are formed from a common conductive layer and the respective second electrodes of the first and second electrodes are formed from a common conductive layer.

18. The apparatus of claim 1 , further comprising a substrate having an air cavity, wherein the respective second electrodes of the first and second acoustic resonators are formed on the substrate over the air cavity.

19. The apparatus of claim 1 , wherein portions of each of the first and second electrodes overlap with each other to define an active region, and the first and second electrode buses are located outside the active region.

20. An apparatus, comprising:

a piezoelectric layer;

a first acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer, the first electrode of the first acoustic resonator comprising a first electrode bus connected to a first plurality of finger structures; and

a second acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer and acoustically coupled to the first acoustic resonator, the first electrode of the second acoustic resonator comprising a second electrode bus connected to a second plurality of finger structures, wherein the respective first electrodes of the first and second acoustic resonators are electrically separated from each other, and the respective second electrodes of the first and second acoustic resonators are electrically connected to each other, and do not overlap either the first electrode bus or the second electrode bus.

21. An apparatus as claimed in claim 20 , wherein portions of each of the first and second electrodes overlap with each other to define an active region, and the first and second electrode buses are located outside the active region.

22. An apparatus as claimed in claim 21 , wherein the first and second pluralities of fingers have a first thickness, and the first and second electrode buses have a second thickness greater than the first thickness.

23. An apparatus as claimed in claim 22 , wherein the second thickness is adapted to maintain a resonance associated with the first and second electrode buses away from the passband.

24. An apparatus as claimed in claim 20 , wherein the respective second electrodes of the first and second acoustic resonators are connected to ground, the first electrode of the first acoustic resonator is connected to an input terminal configured to receive the input signal, and the first electrode of the second acoustic resonator is connected to an output terminal configured to transmit the output signal.

25. An apparatus, comprising:

a piezoelectric layer;

a first acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer, the first electrode of the first acoustic resonator comprising a first electrode bus connected to a first plurality of finger structures; and

a second acoustic resonator comprising first and second electrodes formed on opposite sides of the piezoelectric layer and acoustically coupled to the first acoustic resonator, the first electrode of the second acoustic resonator comprising a second electrode bus connected to a second plurality of finger structures arranged in an interdigital configuration with respect to the first plurality of finger structures, the first and second pluralities of fingers having a first thickness, and the first and second electrode buses having a second thickness greater than the first thickness, wherein the respective second electrodes do not overlap either the first electrode bus or the second electrode bus.

26. An apparatus as claimed in claim 25 , wherein the second thickness is adapted to maintain a resonance associated with the first and second electrode buses away from the passband.

27. An apparatus as claimed in claim 26 , wherein the respective second electrodes of the first and second acoustic resonators are connected to ground, the first electrode of the first acoustic resonator is connected to an input terminal configured to receive the input signal, and the first electrode of the second acoustic resonator is connected to an output terminal configured to transmit the output signal.

28. An apparatus as claimed in claim 25 , wherein portions of each of the first and second electrodes overlap with each other to define an active region, and the first and second electrode buses are located outside the active region.

29. A method of manufacturing an acoustic resonator pair, comprising:

forming a bottom electrode on a substrate:

forming a piezoelectric layer on the bottom electrode;

forming a top electrode on the piezoelectric layer; and

patterning the top electrode to form a first electrode bus connected to a first plurality of finger structures and a second electrode bus connected to a second plurality of finger structures arranged in an interdigital configuration with respect to the first plurality of finger structures; and

removing a portion of the e bottom electrode from a region that overlaps the first and second electrode buses.

30. The method of claim 29 , further comprising:

patterning the bottom electrode to form a third electrode bus connected to a third plurality of finger structures and a fourth electrode bus connected to a fourth plurality of finger structures arranged in an interdigital configuration with respect to the third plurality of finger structures.

31. The method of claim 29 , further comprising, forming the first and second electrode buses with a thickness greater than a thickness of the first and second pluralities of finger structures.

32. The method of claim 29 , further comprising forming fingers among the first and second pluralities of finger structures with different thicknesses.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
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PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
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TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
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PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2012
From: WANG, KUN
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
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