Patent Assignment
Reel/Frame 026427/0875
Assignment of Assignor's Interest
Recorded: 2011-05-27
Pages: 3
Assignors
BAI, KEUN-HEE
Executed: 2011-05-03
LEE, HYO-SAN
Executed: 2011-05-02
LEE, DONG-SEOK
Executed: 2011-05-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fabricating Method of Semiconductor Device