Patent Assignment
Reel/Frame 026453/0148
Assignment of Assignor's Interest
Recorded: 2011-06-17
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
High Density Chip Stacked Package, Package-on-Package and Method of Fabricating the Same