Patent Assignment
Reel/Frame 026454/0515
Assignment of Assignor's Interest
Recorded: 2011-06-16
Pages: 3
Assignor
CHI, SHYH-AN
Executed: 2011-06-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for 3D Ic Test