Patent Assignment
Reel/Frame 026456/0123
Assignment of Assignor's Interest
Recorded: 2011-06-16
Pages: 5
Assignors
LAI, CHIEN-MING
Executed: 2011-04-15
CHEN, YI-WEN
Executed: 2011-04-15
LEE, ZHI-CHENG
Executed: 2011-04-15
HUANG, TONG-JYUN
Executed: 2011-04-15
HSU, CHE-HUA
Executed: 2011-04-15
LIN, KUN-HSIEN
Executed: 2011-04-19
LEE, TZUNG-YING
Executed: 2011-06-04
HSU, CHI-MAO
Executed: 2011-06-04
HUANG, HSIN-FU
Executed: 2011-06-04
LIN, CHIN-FU
Executed: 2011-06-04
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Fabricating Semiconductor Device