Method for fabricating semiconductor device
A method for fabricating a semiconductor device includes the following steps. Firstly, a dummy gate structure having a dummy gate electrode layer is provided. Then, the dummy gate electrode layer is removed to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer. Then, an ammonium hydroxide treatment process is performed to treat the dummy gate structure. Afterwards, a metal material is filled into the opening.
1. A method for fabricating a semiconductor device, the method comprising steps of:
providing a dummy gate structure having a dummy gate electrode layer;
removing the dummy gate electrode layer to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer;
performing an ammonium hydroxide treatment process to treat the dummy gate structure; and
filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60° C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1:120, wherein
at least one-third of the dummy gate electrode layer is removed by a pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process.
2. The method according to claim 1 , wherein the dummy gate structure comprises:
a gate oxide layer formed on a substrate;
a barrier layer formed on the gate oxide layer;
the dummy gate electrode layer formed on the barrier layer; and
a spacer formed over the substrate to surround the gate oxide layer, the barrier layer and the dummy gate electrode layer.
3. The method according to claim 2 , wherein the step of removing the dummy gate electrode layer further comprises a step of pulling back the spacer.
4. The method according to claim 2 , wherein the gate oxide layer is made of a high dielectric constant material, wherein after the gate oxide layer is formed, an ion-implanting process is performed to form source/drain regions in the substrate and adjacent to the dummy gate structure.
5. The method according to claim 1 , further comprising steps of:
performing an ion-implanting process to form source/drain regions in the substrate and adjacent to the dummy gate structure before the step of removing the dummy gate electrode layer is performed; and
forming a high-k dielectric layer within the opening after the ammonium hydroxide treatment process is performed.
6. The method according to claim 1 , wherein the step of removing the dummy gate electrode layer and the ammonium hydroxide treatment process are performed in the same process vessel.
7. A method for fabricating a semiconductor device, the method comprising steps of:
providing a dummy gate structure having a dummy gate electrode layer;
performing a pre-etching process to remove a portion of the dummy gate electrode layer;
performing an ammonium hydroxide treatment process to remove the remaining dummy gate electrode layer, thereby forming an opening in the dummy gate structure and exposing an underlying layer beneath the dummy gate electrode layer; and
filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60° C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1:120 wherein
at least one-third of the dummy gate electrode layer is removed by the pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process.
8. The method according to claim 7 , wherein the pre-etching process is a wet etching process carried out in a tetramethylammonium hydroxide (TMAH) solution.
9. The method according to claim 7 , wherein the dummy gate structure comprises:
a gate oxide layer formed on a substrate;
a barrier layer formed on the gate oxide layer;
the dummy gate electrode layer formed on the barrier layer; and
a spacer formed over the substrate to surround the gate oxide layer, the barrier layer and the dummy gate electrode layer.
10. The method according to claim 9 , further comprising a step of pulling back the spacer after the pre-etching process and before the ammonium hydroxide treatment process.
11. The method according to claim 9 , wherein the gate oxide layer is made of a high dielectric constant material, wherein after the gate oxide layer is formed, an ion-implanting process is performed to form source/drain regions in the substrate and adjacent to the dummy gate structure.
12. The method according to claim 7 , further comprising steps of:
performing an ion-implanting process to form source/drain regions in the substrate and adjacent to the dummy gate structure before the step of removing the dummy gate electrode layer is performed; and
forming a high-k dielectric layer within the opening after the ammonium hydroxidetreatment process is performed.
13. The method according to claim 7 , wherein the step of removing the portion of the dummy gate electrode layer and the ammonium hydroxide treatment process are performed in the same process vessel.