Patent Assignment
Reel/Frame 026476/0732
Assignment of Assignor's Interest
Recorded: 2011-06-22
Pages: 3
Assignors
LEE, JAEGOO
Executed: 2011-06-02
YOU, BYUNGKWAN
Executed: 2011-06-02
PARK, YOUNGWOO
Executed: 2011-06-02
SEOL, KWANG SOO
Executed: 2011-06-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Three-Dimensional Semiconductor Devices