Patent Assignment
Reel/Frame 026488/0959
Assignment of Assignor's Interest
Recorded: 2011-06-23
Pages: 3
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Chip Package Structure and Chip Packaging Method