Patent Assignment
Reel/Frame 026494/0229
Assignment of Assignor's Interest
Recorded: 2011-06-24
Pages: 2
Assignors
LU, CHEN-FA
Executed: 2011-06-15
LIU, CHUNG-SHI
Executed: 2011-06-15
LII, MIRNG-JI
Executed: 2011-06-15
YU, CHEN-HUA
Executed: 2011-06-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structure with Barrier Layer on Post-Passivation Interconnect