Patent Assignment
Reel/Frame 026494/0279
Assignment of Assignor's Interest
Recorded: 2011-06-24
Pages: 3
Assignor
YU, CHI-YEH
Executed: 2011-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Structure for Through-Silicon via (Tsv) with Diffused Isolation Well