Patent Assignment
Reel/Frame 026495/0401
Assignment of Assignor's Interest
Recorded: 2011-06-24
Pages: 4
Assignors
DIEFENDERFER, RANDALL R.
Executed: 2011-06-17
FOSTER, RANDY C.
Executed: 2011-06-17
KARIMIAN, ENAYAT O.
Executed: 2011-06-17
Assignee
DAYCO PRODUCTS, LLC
4500 SOUTH GARNETT ROAD, SUITE 500, TULSA, OKLAHOMA, 74146
Covered Property
(1)
Modular Molding System
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2012
From: DAYCO PRODUCTS, LLC
To: DAYCO IP HOLDINGS, LLC
Reel/Frame 029378/0065 →
Security Agreement
Dec 16, 2013
From: DAYCO IP HOLDINGS, LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031817/0737 →
Security Agreement
Dec 17, 2013
From: DAYCO IP HOLDINGS, LLC
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 031832/0554 →
Patent Release (Reel:03817/Frame:0737)
May 22, 2017
From: BANK OF AMERICA, N.A, AS COLLATERAL AGENT
To: DAYCO IP HOLDINGS, LLC; DAYCO PRODUCTS, LLC
Reel/Frame 042523/0770 →
Security Agreement
May 23, 2017
From: DAYCO IP HOLDINGS, LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042554/0222 →
Release (Reel 042554 / Frame 0222)
Oct 7, 2022
From: BANK OF AMERICA, N.A.
To: DAYCO IP HOLDINGS, LLC
Reel/Frame 061623/0587 →