Patent Assignment
Reel/Frame 026497/0414
Assignment of Assignor's Interest
Recorded: 2011-06-24
Pages: 4
Assignee
CONEXANT SYSTEMS, INC.
4000 MACARTHUR BOULEVARD, NEWPORT BEACH, CALIFORNIA, 92660
Covered Property
(1)
Externally Wire Bondable Chip Scale Package in a System-in-Package Module
Application:
13/168,605 →
Publication:
US 2012/0326304
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Aug 18, 2011
From: CONEXANT SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 026774/0839 →
Release of Security Interest
May 6, 2016
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: CONEXANT SYSTEMS, INC.; CONEXANT, INC.; CONEXANT SYSTEMS WORLDWIDE, INC.; BROOKTREE BROADBAND HOLDING, INC.
Reel/Frame 038631/0452 →
Change of Name
May 20, 2016
From: CONEXANT SYSTEMS, INC.
To: LAKESTAR SEMI INC.
Reel/Frame 038777/0885 →
Assignment of Assignor's Interest
May 23, 2016
From: LAKESTAR SEMI INC.
To: CONEXANT SYSTEMS, INC.
Reel/Frame 038803/0693 →