Externally Wire Bondable Chip Scale Package in a System-in-Package Module
There is provided a system and method for an externally wire bondable chip scale package in a system-in-package module. There is provided a system-in-package module comprising a substrate including a first contact pad disposed thereon, a packaged device attached to the substrate, wherein an electrode of the packaged device is wirebonded to the first contact pad, and an unpackaged device, wherein an electrode of the unpackaged device is coupled to the substrate. By flipping the packaged device within the module and utilizing wire bondable finishes on the packaged device, an externally wire bondable chip scale package may be provided. The structure of the disclosed system-in-package module provides several advantages over conventional designs including increased yields, a single assembly line, facilitated die substitution, reduced heat stress, higher package density, and a simplified single package structure for reduced fabrication time and cost.
1 . A system-in-package module comprising:
a substrate including a first contact pad disposed thereon;
a packaged device attached to the substrate, wherein an electrode of the packaged device is wirebonded to the first contact pad;
an unpackaged device, wherein an electrode of the unpackaged device is coupled to the substrate.
2 . The module of claim 1 , wherein the unpackaged device is stacked atop the packaged device using an adhesive epoxy.
3 . The module of claim 1 , wherein the unpackaged device is attached to the substrate using an adhesive epoxy.
4 . The module of claim 1 , wherein the electrode of the unpackaged device is wirebonded to a second contact pad of the substrate.
5 . The module of claim 1 , wherein the electrode of the unpackaged device is wirebonded to the electrode of the packaged device.
6 . The module of claim 1 , wherein the packaged device includes an electroless nickel, electroless palladium, immersion gold finish on the electrode.
7 . The module of claim 1 , wherein the packaged device includes an electroless nickel, electroless gold finish on the electrode.
8 . The module of claim 1 , wherein the substrate is a ball grid array (BGA) substrate.
9 . The module of claim 1 , wherein the packaged device is attached to the substrate using an adhesive epoxy.
10 . The module of claim 1 , further comprising a mold compound encapsulating the module.
11 . A method of fabricating a system-in-package module, the method comprising:
creating a substrate including a first contact pad disposed thereon;
attaching a packaged device to the substrate, wherein an electrode of the packaged device is wirebonded to the first contact pad;
attaching an unpackaged device within the module, wherein an electrode of the unpackaged device is coupled to the substrate.
12 . The method of claim 11 , wherein the attaching of the unpackaged device is by stacking atop the packaged device using an adhesive epoxy.
13 . The method of claim 11 , wherein the attaching of the unpackaged device is to the substrate using an adhesive epoxy.
14 . The method of claim 11 , wherein the electrode of the unpackaged device is wirebonded to a second contact pad of the substrate.
15 . The method of claim 11 , wherein the electrode of the unpackaged device is wirebonded to the electrode of the packaged device.
16 . The method of claim 11 , wherein the packaged device includes an electroless nickel, electroless palladium, immersion gold finish on the electrode.
17 . The method of claim 11 , wherein the packaged device includes an electroless nickel, electroless gold finish on the electrode.
18 . The method of claim 11 , wherein the substrate is a ball grid array (BGA) substrate.
19 . The method of claim 11 , wherein the attaching of the packaged device and the attaching of the unpackaged device uses a single assembly line.
20 . The method of claim 11 , further comprising encapsulating the module with a mold compound.