Patent Assignment
Reel/Frame 026497/0455
Assignment of Assignor's Interest
Recorded: 2011-06-24
Pages: 4
Assignors
SINGH, HARPUNEET
Executed: 2010-01-19
SHANGGUAN, DONGKAI
Executed: 2010-01-19
TAM, SAMUEL WAISING
Executed: 2010-01-19
Assignee
FLEXTRONICS AP LLC
305 INTERLOCKEN PARKWAY, BROOMFIELD, COLORADO, 80021
Covered Property
(1)
Wafer level camera module with molded housing and method of manufacturing
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 12, 2012
From: FLEXTRONICS AP, LLC
To: DIGITALOPTICS CORPORATION
Reel/Frame 028948/0790 →
Assignment of Assignor's Interest
Feb 3, 2015
From: DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; FOTONATION LIMITED
To: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD
Reel/Frame 034883/0237 →