Patent Assignment
Reel/Frame 026498/0763
Assignment of Assignor's Interest
Recorded: 2011-06-23
Pages: 3
Assignor
KIM, WOO-JAE
Executed: 2011-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Stack Type Semiconductor Package