IP Library › Assignment 026504/0794
Patent Assignment
Reel/Frame 026504/0794

Assignment of Assignor's Interest

Recorded: 2011-06-27 Pages: 2
Assignor
Assignee
ORACLE INTERNATIONAL CORPORATION
500 ORACLE PARKWAY, MAIL STOP 5OP7, REDWOOD SHORES, CALIFORNIA, 94065
Covered Property (1)
Multi-Chip Module with Multi-Level Interposer
Patent: 8,218,334 →
Application: 12/719,975 →
Publication: US 2011/0223778
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2010
From: CHOW, EUGENE M.
To: PALO ALTO RESEARCH CENTER INCORPORATED
Reel/Frame 024349/0114 →
Assignment of Assignor's Interest May 6, 2010
From: CUNNINGHAM, JOHN E.; MITCHELL, JAMES G.; SHUBIN, IVAN
To: ORACLE INTERNATIONAL CORPORATION
Reel/Frame 024349/0127 →