IP Library › Assignment 026511/0688
Patent Assignment
Reel/Frame 026511/0688

Assignment of Assignor's Interest

Recorded: 2011-06-28 Pages: 2
Assignor
KITAMURA, YOSHIHIRO
Executed: 2011-06-15
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Method of Fabricating Semiconductor Device Allowing Smooth Bump Surface
Patent: 8,765,594 →
Application: 13/167,448 →
Publication: US 2011/0318918
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032898/0319 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →