Patent Assignment
Reel/Frame 026535/0130
Assignment of Assignor's Interest
Recorded: 2011-06-15
Pages: 3
Assignors
AHN, MIN SU
Executed: 2011-05-23
KIM, CHANG SU
Executed: 2011-06-10
AHN, JAE KYUN
Executed: 2011-06-10
KIM, DO KYOON
Executed: 2011-06-10
LEE, DAE YOUN
Executed: 2011-06-10
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-742, KOREA, REPUBLIC OF
KOREA UNIVERSITY INDUSTRIAL & ACADEMIC COLLABORATION FOUNDATION KORA UNIV.
ANAM-DONG 5 (O)-GA, SEONGBUK-GU, SEOUL 136-701, REPUBLIC OF, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method of Scalable Encoding of 3D Mesh, and Apparatus and Method of Scalable Decoding of 3D Mesh