Patent Assignment
Reel/Frame 026536/0521
Assignment of Assignor's Interest
Recorded: 2011-07-01
Pages: 2
Assignors
JANG, HYEON-WOO
Executed: 2011-06-27
KIM, BONG-SOO
Executed: 2011-06-27
LIM, CHAE-HO
Executed: 2011-06-27
MIN, HYO-SUN
Executed: 2011-06-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device, Method of Fabricating the Same, and Semiconductor Module and Electronic System Including the Semiconductor Device