Patent Assignment
Reel/Frame 026550/0402
Assignment of Assignor's Interest
Recorded: 2011-07-06
Pages: 2
Assignor
ZHAO, CHAO
Executed: 2011-06-20
Assignee
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
NO. 3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT, BEIJING, 100029, CHINA
Covered Property
(1)
Metal Interconnection Structure and Method for Forming Metal Interlayer via and Metal Interconnection Line