Patent Assignment
Reel/Frame 026553/0919
Assignment of Assignor's Interest
Recorded: 2011-07-07
Pages: 5
Assignors
TSAI, SHUANG-JI
Executed: 2011-06-30
YAUNG, DUN-NIAN
Executed: 2011-06-30
LIN, JENG-SHYAN
Executed: 2011-06-30
LIU, JEN-CHENG
Executed: 2011-06-30
WANG, WEN-DE
Executed: 2011-06-30
LIN, YEUH-CHIOU
Executed: 2011-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Backside Illumination Sensor Having a Bonding Pad Structure and Method of Making the Same