Patent Assignment
Reel/Frame 026559/0660
Assignment of Assignor's Interest
Recorded: 2011-07-01
Pages: 3
Assignors
LEE, CHUNG-SUN
Executed: 2011-06-24
KIM, JUNG-HWAN
Executed: 2011-06-24
MIN, TAE-HONG
Executed: 2011-06-24
SONG, HYUN-JUNG
Executed: 2011-06-24
YOUN, SUN-PIL
Executed: 2011-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including a Stack of Semiconductor Chips, Underfill Material and Molding Material