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Patent Assignment
Reel/Frame 026566/0672

Assignment of Assignor's Interest

Recorded: 2011-07-07 Pages: 3
Assignors
KIM, JUNG-SIK
Executed: 2011-03-21
LEE, DONG-HYUK
Executed: 2011-03-22
LEE, HO-CHEOL
Executed: 2011-03-21
RYU, JANG-WOO
Executed: 2011-03-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SOUTH, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device with Stacked Structure Having Through Electrode, Semiconductor Memory Device, Semiconductor Memory System, and Operating Method Thereof
Patent: 8,801,279 →
Application: 13/177,103 →
Publication: US 2012/0163413