Patent Assignment
Reel/Frame 026609/0276
Assignment of Assignor's Interest
Recorded: 2011-07-18
Pages: 3
Assignor
KOBAYASHI, KAZUHIKO
Executed: 2011-07-08
Assignee
APIC YAMADA CORPORATION
90, OOAZA KAMITOKUMA, CHIKUMA-SHI, NAGANO, 389-0898, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method