Patent Assignment
Reel/Frame 026611/0191
Assignment of Assignor's Interest
Recorded: 2011-07-19
Pages: 2
Assignors
KAJIWARA, RYOICHI
Executed: 2011-05-18
MOTOWAKI, SHIGEHISA
Executed: 2011-06-21
ASAUMI, YUSUKE
Executed: 2011-05-24
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Sintering Silver Paste Material and Method for Bonding Semiconductor Chip