IP Library Assignment 026619/0707
Patent Assignment
Reel/Frame 026619/0707

Assignment of Assignor's Interest

Recorded: 2011-06-28 Pages: 2
Assignor
SAEKI, YOSHIHIRO
Executed: 2008-11-05
Assignee
OKI SEMICONDUCTOR CO., LTD.
2-4-8 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA 222-8575, JAPAN
Covered Property (1)
Semiconductor Device Fabricating Method and Fabricating Apparatus
Patent: 8,484,820 →
Application: 13/067,804 →
Publication: US 2011/0258849
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →