Patent Assignment
Reel/Frame 026621/0675
Assignment of Assignor's Interest
Recorded: 2011-07-20
Pages: 2
Assignors
SUZUKI, MASAMI
Executed: 2011-07-12
NAGAO, MASAYUKI
Executed: 2011-07-12
ITO, YASUYUKI
Executed: 2011-07-12
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method for a Semiconductor Package as Well as Optical Module